MANUFACTURER:
- receiving-transmitting equipment for the satellite communication stations, radioastronomic, radar and radiometer stations;
- transmitting and receiving equipment for TV-broadcasting;
- transmitting and receiving equipment for creating the radiorelay lines of cm- and mm-wave range;
- super low noise cryogenically cooled amplifying-converting units;
- 4...60 GHz transistors;
- 4...60 GHz multiplier, mixer and detector diodes;
- 8...300 GHz phase manipulator, balance mixer, detectors and so on;
- 0.1...90 GHz low noise transistor amplifiers;
- 60...120 GHz amplifying-converting modules;
- temperature and pressure sensor;
- hybrid-integrated circuits;
- monolithic-integrated circuits.

   SCIENCE-TECHNICAL DIRECTIONS
- receiving-amplifying system, microwave converters, devices of cm- and mm- frequency range;
- supersensitive receiving-amplifying sys-tem with thermoelectric and cryogenic cooling;
- creation of systems for digital and TV radiorelay lines;
- radiometric receiving units and systems;
- creation of microwave GaAs low noise transistors, diodes, MICs;
- creation of electronic medical equipment.

     Available technologies

• Technologies of electro-mechanical treatment:
  - spark treatment;
  - ultrasonic treatment.
  
• Technologies of thermal treatment:
  - hardening;
  - tempering;
  - light annealing;
  - annealing.
  
• Technologies:
  - waveguide manufacturing of different cross-sections;
  - radio absorbent materials manufacturing;
  - preparing of filling materials and glue on the base of epoxy;
  - preparing of the current conducting glue.
  
• Welding technologies:
  - spot welding;
  - gas shielded welding;
  - electron-beam welding;
  - laser welding.
  
• Technologies of chemical and electrochemical coating of ferrous and non-ferrous metals:
  - copper coating;
  - nickel coating;
  - zinc coating;
  - cadmium coating;
  - electro-chemical polishing;
  - SnBi coating;
  - argentum coating;
  - aurum coating;
  - oxide coating;
  - possivating;
  - degreasing.
  
  
• Technological process of injection moulding and manufacturing of details from thermoplastic and thermosetting plastic.
  
• Main technological process used under manufacturing of microelectronic devices:
  - electron-beam printing of sub-micron elements;
  - mask manufacturing;
  - hole metallization of semiconductor substrates
  - photoresist deposit;
  - vacuum deposition of different conduction layers;
  - etching;
  - electro-chemical metal deposition;
  - laser adjust of thinfilm resistor ;
  - ohmic conductor firing;
  - scribing and laser cutting;
  - condenser energy-storage, thermocompressing and thermal impulse welding;
  - final cleaning;
  - processing for manufacturing of components with the topology elements having dimensions up to 0.2 micrometer.
  

   SHORT DESCRIPTION OF THE WORKSHOPS:

buildings, laboratory-industrial bays of the total space	3000 sq.m
mechanical bay of the total space	5560 sq.m
HI circuit manufacturing-adjusting department	216 sq.m
HI circuit adjusting department	66 sq.m
HI circuit assembling department	306 sq.m
working bay of the transistor manufacturing	54 sq.m
working bay of the MIC manufacturing	864 sq.m
mechanical treatment working bay of the dielectric and semiconductor materials	162 sq.m
working bay of the photo-printing	216 sq.m
working bay of the electron-beam printing	378 sq.m

   LABOR RESOURCES

Category	Number of the persons (as of 1 Sep. 1999)
managers	42
scientists	48
specialists	350
designers	50
technologists	80
office workers	18
workers	450
Total:	958
among them:                                      Ph.D (candidate of Science)	22
Doctors of Science наук	2
Academics	2